Itekhnoloji eNtsha yokusika - iLaser Die Cutting

Enye yeglasi yethu encinci ecocekileyo epholileyo iphantsi kwemveliso, esebenzisa itekhnoloji entsha-Laser Die Cutting.

Yeyona ndlela iphakamileyo yesantya sokwenziwa kwemveliso kumthengi ofuna kuphela ukuhlelwa okugudileyo kubungakanani obuncinci beglasi eqiniweyo.

Imveliso yemveliso yi-20pcs ngaphakathi kwemizuzu eyi-1 yale mveliso ngokunyamezela ngokuchanekileyo +/-0.1mm.

Ke, yintoni i-laser die cut for glass?

I-laser kukukhanya okufana nokunye ukukhanya kwendalo kudityaniswe kukutsiba kwee-athomu (iimolekyuli okanye ii-ion, njl.). Kodwa yahlukile ekukhanyeni okuqhelekileyo kuxhomekeke kwimitha ezenzekelayo kwixesha elifutshane kakhulu. Emva koko, inkqubo igqitywe ngokupheleleyo yimitha, ngoko ke i-laser inombala ococekileyo kakhulu, phantse akukho mkhombandlela wokuhlukana, ukukhanya okukhanyayo okuphezulu, ukusebenzisana okuphezulu, ubukhulu obuphezulu kunye neempawu eziphezulu.

Ukusika kweLaser ngumqadi welaser okhutshwa kwijenereyitha yelaser, ngenkqubo yesekethe yangaphandle, igxile kuxinzelelo lwamandla aphezulu eemeko zokukhanya kwelaser, ubushushu belaser bufunxwa yimathiriyeli yesixhobo sokusebenza, iqondo lobushushu lesixhobo sokusebenza lenyuka kabukhali, lafikelela kwindawo yokubilisa, izinto zaqala ukunuka zaza zenza imingxunya, ngomqadi kunye nesixhobo sokusebenza sendawo ehambelana nentshukumo, kwaye ekugqibeleni yasikwa. Iiparamitha zenkqubo (isantya sokusika, amandla e-laser, uxinzelelo lwegesi, njl.) kunye ne-trajectory yokuhamba ilawulwa yinkqubo yokulawula amanani, kwaye i-slag kwi-seam yokusika ikhutshwe yigesi encedisayo kwixinzelelo oluthile.